Technologies inventor and manufacturer, Honeywell International, has raised a total of $1.4 billion in a two-part bond sale, The Wall Street Journal reports. The first tranche of notes worth $800 million, which carry a coupon rate of 4.25%, will mature on March 1, 2021, while the second tranche of $600 million bonds, which carry a coupon rate of 5.37%, will be due on March 1, 2041. The U.S. conglomerate company will use the proceeds from the offering to buy-back $400 million of its outstanding 5.625% notes, due in August 2012, to repay commercial paper and for general corporate purposes. The joint book-running managers on the sale were Bank of America Merrill Lynch, Barclays and Citi.

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