ASE Plans $102M Bond Sale

Advanced Semiconductor Engineering is seeking to raise $101.63 million through a bond sale to boost its working capital.

Advanced Semiconductor Engineering (ASE) is seeking to raise $101.63 million through a bond sale to boost its working capital, Focus Taiwan News Channel reports. It is planning to issue yuan-denominated bonds in two tranches in Hong Kong via its wholly owned unit Anstock.

The Taiwanese company will sell three-year bonds worth $23 million in the first piece, while five-year bonds worth $78.15 million will be offered in the second tranche. Cathay Securities and Citibank will be underwriters for the offering.

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